KITEC microelectronic technologie

Metrology and Wafer Inspection

Further information

Different Application such as:

Integrated Wafer Metrology Platform and Wafer Inspection

Five Integrated Measurement Domains

WAFER GEOMETRY

  • Bow/warp/TTV
  • SFQR
  • Edge-Roll-Off
  • Global shape

NANO-TOPOGRAPHY

  • Local flatness
  • CMP monitoring
  • Surface texture
  • Roughness

FILM THICKNESS

  • Thin transparent films
  • Thickness mapping
  • Uniformity
  • Stress induced

BONDING METROLOGY

  • Pre-bonding shape
  • Void Risk assessment
  • Chip tilt / warpage
  • Edge delaminations

SURFACE INSPECTION

  • Surface Macro-defect
  • Particles
  • Scratches
  • Pattern Breaks

DIP-View VISION

  • Small Samples
  • manual loading

DIP-View VISION

  • up to 300mm wafer sizes
  • manual loading

DIP-View VISION 200/300

  • up to 300mm wafer sizes
  • automatic operating
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