System to select a wafer from the carrier from one load port and to present that wafer for the optical surface inspection with the option to load that wafer on a platform. The wafer may be removed manually from that platform for the visual inspection and placed back to the platform and further returned to the origin slot of the cassette.
Wafer Topography Inspection
Mannual or automatic C-to-C wafer topographie by deflectrometrie for inspections such as sawing, grinding, polishing or CMP, thinning, back side thinning and warpage and several other inspections during manufacturing processes.