is a product line of non-contact resistance measurement
systems to measure conductive wafers or wafers with a
conductive layer, eg. after an EPI, implant- or metallization
process. This product line also includes systems for research
and development (M-RES 20-xxx) which may not only be
used with wafers but also other substrates of different shape
and thickness up to 1mm.
are systems available with
conventional eddy current measurement technology (M-RES
12xx) or measurement systems with advanced eddy current
measurement technology (M-RES 2xxx).
For systems with conventional eddy current measurement
technology, the measurement signal of the sensors is
determined without considering the environment and the
conditions of the measurement apparatus.
systems of advanced eddy current measurement technology
include the wafer thickness measurement in addition to
resistance measurement. By measuring both values in the same
place, it becomes possible to determine the absolute resistance
value capable to correlate with other measurement methods. Furthermore,
this technology considers possible wafer bow and
warp. The measured value is directly correlated to
other measurement methods and tool-to-tool correlation
is <1%. The measurement systems with advanced eddy
current measurement technology of the series M-RES 2xxx
are therefore particularly suitable for production lines with
multiple measurement systems in parallel and provide reliable
data correlating between different production lines.
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